• Description for 3M 3755LM

    “Delayed-tack” applied in thin-glue-line ribbon for bonding paper, corrugated, chipboard, P.O.P. displays and exhibits

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Polystyrene Foam, ChipBoard, Fabric, Corrugated, Uncoated Cardboard, Uncoated Chipboard
    Chemistry Hot melt, Jet-melt, Low Melt
    Cure Method Hot melt
    Viscosity (cPs) 13,000
    Color Clear
    High Temperature Resistance (°C) 49
    Key Specifications FDA 21 CFR 175.105
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

    *See Terms of Use Below

Viscosity Test Methods
Viscosity Test Method Temperature
13,000 cPs Brookfield Thermosel Viscometer in Centipoise. 121°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
2.00 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Softening Point Test Methods
Softening Point Unit Test Method
70.0°C ASTM E-28-99
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
500 psi Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
380 psi 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
13 piw Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
49°C Temperature at which adhesive fails