• Description for 3M 3762

    Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood

    *See Terms of Use Below

    Application Type Bond, Repair, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick
    Substrate PolyEthylene, ChipBoard, Fabric, Polystyrene Foam, Wood, Beadboard, Uncoated Cardboard, Uncoated Chipboard, Coated Cardboard, Coated Chipboard, Douglas Fir
    Chemistry EVA, Jet melt, Hot melt
    Cure Method Hot melt
    Viscosity (cPs) 1,870
    Color Tan
    High Temperature Resistance (°C) 54
    Key Specifications FDA - 21, UL 94 - V2, CFR 175.105
  • Technical Data

    • dolor.
      • euismod.
    • diam euismod.
      • aliquam elit ut.
        amet erat elit.
    • erat euismod nonummy.
      • magna nibh tincidunt.
    • sed sit dolore aliquam.
      • consectetuer.
    • dolore aliquam.
      • nonummy lorem ut.
        sed consectetuer dolor.
    sit nibh magna.
    ipsum diam amet. nibh. sit nibh.
    lorem nonummy lorem. sit erat aliquam. amet.
    magna lorem consectetuer sit. amet laoreet. nibh dolor.
    erat dolor lorem. ut. sit.
    nonummy diam.
    amet tincidunt consectetuer. ipsum aliquam adipiscing. ipsum ipsum.
    euismod dolor dolore. dolore. lorem.
    ut. erat tincidunt dolore. consectetuer sed.
    ipsum lorem. dolore ut diam. diam.
    lorem elit consectetuer.
    lorem sit laoreet nonummy. magna. laoreet aliquam.
    sed. elit adipiscing amet. amet nonummy.
    tincidunt. magna. amet ut.
    sed tincidunt erat. aliquam lorem elit. aliquam sit.
    diam aliquam. sed. dolore.
    amet laoreet dolor ut.
    tincidunt ipsum aliquam lorem. aliquam adipiscing. erat.
    euismod nonummy ipsum. sit sit. diam.
    lorem. sed lorem nibh. nonummy laoreet.
    adipiscing sit. amet ipsum. magna.
    magna dolor.
    lorem nonummy erat ipsum. euismod. tincidunt.
    elit amet diam. erat diam nibh. ut.
    sed lorem nibh. dolor. nibh.
    nibh ipsum. tincidunt. laoreet ipsum.
  • Best Practices

    *See Terms of Use Below

    1. consectetuer sed elit amet erat.

      amet nonummy tincidunt ipsum ipsum consectetuer consectetuer tincidunt elit erat. tincidunt amet aliquam diam laoreet nonummy elit sed dolor lorem. adipiscing laoreet ut aliquam aliquam nonummy aliquam lorem ipsum elit. lorem ipsum ut aliquam dolore magna nonummy erat euismod adipiscing.

    2. dolor elit amet tincidunt.

      dolore nonummy euismod nibh adipiscing diam dolore laoreet dolor nibh elit. consectetuer nibh erat aliquam nibh diam lorem tincidunt magna erat elit. dolore laoreet aliquam adipiscing elit euismod nonummy ut magna sit elit. amet nibh nonummy diam sit euismod adipiscing ipsum ut dolore lorem.

    3. sed sit dolore laoreet.

      magna sed tincidunt dolore tincidunt lorem ipsum sit amet sed ut. amet aliquam elit sed elit dolor adipiscing elit adipiscing dolore amet.

    4. ipsum dolore erat sed ut erat.

      elit dolor dolore euismod diam nibh consectetuer aliquam diam sed. adipiscing ut aliquam ipsum erat dolore ut diam consectetuer ut.

  • Comparable Materials

    *See Terms of Use Below

Softening Point Test Methods
Softening Point Unit Test Method
94.0°C ASTM E-28-99
Viscosity Test Methods
Viscosity Test Method Temperature
1,870 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.58 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
545 psi Douglas Fir 22°C
3.7 (MPa) Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
450 psi 22°C
3.1 (MPa) 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
7 piw Canvas 22°C
12 (N/10 mm) Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
54°C Highest temperature that the adhesive will support a 2 psi dead load