Hernon Ultrabond 47371

Hernon Ultrabond 47371 Datasheet
  • Description for Hernon Ultrabond 47371

    Hernon Ultrabond 47371 is a 1 Part UV curable No solvents Liquid used to Adhere A wide variety of substrates and A variety of surfaces

    *See Terms of Use Below

    Brand Ultrabond
    Application Type Adhesion, Sealant
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Manufacturer Hernon
    Chemistry No solvents, Modified Acrylic Ester
    Cure Method UV curable, Room temperature cure
    Cure Temperature (°C) 20 to 25 Room temperature
    Cure Time (min) Rapid, Fast
    Viscosity (cPs) 2,600, Medium
    Fluorescent Fluorescent
    Color Blue
    High Temperature Resistance (°C) 177
    Low Temperature Resistance (°C) -54
  • Technical Data

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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room temperature
Cure Time Test Methods
Cure Time Test Method
Fast When exposed to high intensity ultraviolet light (365 nm)
Viscosity Test Methods
Viscosity Test Method Temperature
2,600 cPs Uncured 25°C
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method
0.08 min 100mW/cm² at 365 nm, glass microscope slides
Tack Free Time Test Methods
Tack Free Time Test Method
<0.33 min 100mW/cm² at 365 nm
Tensile Strength Test Methods
Tensile Strength Test Method
3,250 psi ASTM D638, Cured
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
177°C Cured
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-54°C Cured
Dielectric Strength Test Methods
Dielectric Strength Test Method
36 (kV/mm) ASTM D149, cured
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.25 ASTM D150, 1 kHz, cured
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.03000 ASTM D150, 1 kHz, cured
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.7e15 (ohms.cm) ASTM D257, cured
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.10 W/m°K Coefficient of thermal conductivity, ASTM C177, Cured
Modulus Test Methods
Modulus Test Method
108,000 psi ASTM D638, Cured
Elongation Test Methods
Elongation Test Method
85 % ASTM D638, Cured
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
1.100 25°C Uncured
Flash Point Test Methods
Flash Point Test Method
>199.4°F Uncured
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
80e-6 (K-1) ASTM D696, cured