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Thermal Gap Fillers for Automotive


ThermoSink 35-1

Gap Filler; 2 Part; Liquid; Silicone; 2-Part Cure;
A two-component, flowable, thermally conductive silicone elastomer that cures rapidly at room temperature. It is designed for electrical potting and/or thermal interfacial applications where high-performance thermal management is required.;
Manufacturer: Resin Designs
Industry: Automotive; Electrical potting; Electronic Assembly; Housing and Assembly; Housing and Assembly; Power Supplies; Thermal interfacial applications where high-performance thermal management is required.
Substrate: Ceramic; Engineered Plastic; Glass; Metal

Dowsil TC-4525 Thermally Conductive Gap Filler

Thermally Conductive Gap Filler; 2 Part; Liquid; Silicone; 2-Part Cure;
Thermally conductive silicone gap filler material for automotive electronics, two part material curing at room temperature.;
Manufacturer: Dow
Industry: Automotive applications; E-Mobility Solutions; Automotive electronics; Engine; Master Control Module; Printed circuit board; Smart Meters; Transmission control unit

Dowsil TC-4525 GB Thermally Conductive Gap Filler

Gap Filler ; 2 Part; Liquid; Silicone; 2-Part Cure;
2.5 W/m·K Silicone Gap Filler material for automotive applications, Glass Beads option (180 micron), two part material curing at room temperature.;
Manufacturer: Dow
Industry: Automotive applications; E-Mobility Solutions; Engine; Master Control Module; Printed circuit board; Transmission control unit

Dowsil TC-4551 CV Thermally Conductive Gap Filler

Gap Filler; 2 Part; Liquid; Controlled silicone volatility; 2-Part Cure;
A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for electronics modules like an engine or transmission control unit. ;
Manufacturer: Dow
Industry: E-Mobility Solutions; Automotive electronic modules; Engine; Heat sink; Printed circuit board, Protection of sensitive circuits; Transmission control unit

Bergquist Gap Filler TGF 3010APS

Gap Filler; 2 Part; Liquid; Non-silicone; Room temperature curable;
A non-silicone, two-part, room temperature curable gap filler suitable for use in high-throughput assembly applications. This material is an exceptional choice for use in auto and consumer applications.;
Manufacturer: Henkel
Industry: Auto applications; Automotive power storage; Applications requiring high thermal transfer; Applications requiring low compressive stress; Consumer applications; High-throughput assembly applications; Housing and Assembly; Processes requiring high dispense rate; Silicone-sensitive applications

Gap Pad 1000SF

Thermally Conductive Gap Filling Material; 1 Part; Pad; Silicone free; Pressure-Sensitive;
A thermally conductive, Gap Filling Material, electrically insulating, silicone-free polymer. ;
Manufacturer: Henkel
Industry: Automotive modules; CD-ROM; Control Module; Digital disk drives ; Fiber optics modules; Housing and Assembly; Housing and Assembly; Master Control Module
Substrate: Fiberglass

Dowsil TC-4040 Dispensable Thermal Pad

Gap Filler; 2 Part; Pre-Cure: Liquid; Polydimethylsiloxane; Accelerated heat cure;
Two-part, 1-to-1 mix ratio, blue color, thermally conductive dispensable thermal pad suitable for the protection in electrical/ electronic applications where heat dissipation is needed.;
Manufacturer: Dow
Industry: Advanced driver-assistance systems (ADAS); E-Mobility Solutions; Electrical applications; Electronic applications

Bergquist Gap Pad TGP 3004SF

Gap filling material; 1 Part; Pad; Silicone-free; Pressure Sensitive;
High performance, 3.0 W/m-K, thermally conductive gap filling material.;
Manufacturer: Henkel
Industry: Automotive electronics; Batteries; HEV; NEV; Hard disk drives; HDD case to tray; HDD/SSD combination drives; Laser optics; Laser optics; LED lighting; Medical devices; Optical components; Solar energy; Thermal management

Bergquist Gap Pad TGP 3000

Soft “S-Class” Gap Filling Material; 1 Part; Pad; Silicone; Pressure Sensitive;
A Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material and Fiberglass reinforced for puncture, shear and tear resistance.;
Manufacturer: Henkel
Industry: Power conversion; BGA packages; Clip Mounting; Fixed clip mounting; Fixed standoff; Low-stress applications; Mass storage drives; Processors; Server S-RAMs, Notebook computers; Thermal management; Wireline / wireless communications hardware
Substrate: Fiberglass reinforced

Dowsil TC-4535 CV Thermally Conductive Gap Filler

Gap Filler; 2 Part; Pre-Cure: Liquid; Silicone; Accelerated heat cure;
A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.;
Manufacturer: Dow
Industry: Advanced driver-assistance systems (ADAS); Automotive PCB modules; E-Mobility Solutions; Automotive PCB modules, Printed circuit board; Displays; Engine; Heat sink; Transmission control unit.

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Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Gap Filler

;

Potting

Automotive

;

Electrical potting

;

Electronic Assembly

;

Housing and Assembly

;

Housing and Assembly

;

Power Supplies

;

Thermal interfacial applications where high-performance thermal management is required.

2 Part

Liquid

Ceramic

;

Engineered Plastic

;

Glass

;

Metal

Order Sample

Thermally Conductive Gap Filler

Automotive applications

;

E-Mobility Solutions

;

Automotive electronics

;

Engine

;

Master Control Module

;

Printed circuit board

;

Smart Meters

;

Transmission control unit

2 Part

Liquid

Order Sample

Gap Filler

Automotive applications

;

E-Mobility Solutions

;

Engine

;

Master Control Module

;

Printed circuit board

;

Transmission control unit

2 Part

Liquid

Order Sample

Gap Filler

E-Mobility Solutions

;

Automotive electronic modules

;

Engine

;

Heat sink

;

Printed circuit board, Protection of sensitive circuits

;

Transmission control unit

2 Part

Liquid

Order Sample

Gap Filler

Auto applications

;

Automotive power storage

;

Applications requiring high thermal transfer

;

Applications requiring low compressive stress

;

Consumer applications

;

High-throughput assembly applications

;

Housing and Assembly

;

Processes requiring high dispense rate

;

Silicone-sensitive applications

2 Part

Liquid

Order Sample

Thermally Conductive Gap Filling Material

Automotive modules

;

CD-ROM

;

Control Module

;

Digital disk drives

;

Fiber optics modules

;

Housing and Assembly

;

Housing and Assembly

;

Master Control Module

1 Part

Pad

Fiberglass

Order Sample

Gap Filler

;

Thermal interface material

;

Thermal Pad

Advanced driver-assistance systems (ADAS)

;

E-Mobility Solutions

;

Electrical applications

;

Electronic applications

2 Part

Post-Cure: Elastomer

;

Pre-Cure: Liquid

Order Sample

Gap filling material

;

Gap Pad

;

TIM (Thermal Interface Material)

Automotive electronics

;

Batteries

;

HEV

;

NEV

;

Hard disk drives

;

HDD case to tray

;

HDD/SSD combination drives

;

Laser optics

;

Laser optics

;

LED lighting

;

Medical devices

;

Optical components

;

Solar energy

;

Thermal management

1 Part

Pad

Order Sample

Soft “S-Class” Gap Filling Material

;

Gap Pad

;

TIM (Thermal Interface Material)

Power conversion

;

BGA packages

;

Clip Mounting

;

Fixed clip mounting

;

Fixed standoff

;

Low-stress applications

;

Mass storage drives

;

Processors

;

Server S-RAMs, Notebook computers

;

Thermal management

;

Wireline / wireless communications hardware

1 Part

Pad

Fiberglass reinforced

Order Sample

Gap Filler

Advanced driver-assistance systems (ADAS)

;

Automotive PCB modules

;

E-Mobility Solutions

;

Automotive PCB modules, Printed circuit board

;

Displays

;

Engine

;

Heat sink

;

Transmission control unit.

2 Part

Post-Cure: Elastomer

;

Pre-Cure: Liquid

Order Sample
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