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EMI-FS-M5
Electromagnetic interference (EMI) shielding; 1 Part; Gel; Fluorosilicone; None;
Shielding, grounding and environmental sealing; fluorosilicone; 30 mesh Monel wire cloth;
Manufacturer:
Resin Designs
Substrate:
Dissimilar metal surfaces
EMI-FS-M2
Electromagnetic interference (EMI) shielding; 1 Part; Gel; Fluorosilicone; None;
Shielding, grounding and environmental sealing; fluorosilicone; 60 mesh Monel wire cloth;
Manufacturer:
Resin Designs
Substrate:
Copper; Dissimilar metal surfaces; Nickel
EMI-TGSI-M5
Electromagnetic interference (EMI) shielding; 1 Part; Strip; Silicone; None;
Shielding, grounding and environmental sealing; high-performance silicone; 30 mesh Monel wire cloth;
Manufacturer:
Resin Designs
Substrate:
Copper; Dissimilar metal surfaces; Nickel
EMI-TGSI-M2
Shielding and effective grounding of high energy EMI; 1 Part; Gel; Silicone; None;
Shielding, grounding and environmental sealing; standard silicone; 60 mesh Monel wire cloth;
Manufacturer:
Resin Designs
Substrate:
Dissimilar metal surfaces
EMI-CSI-M3
EMI shielding; 1 Part; Gel; Silicone; None;
Commercial-grade, pre-cured silicone gel with Monel circular knit rope;
Manufacturer:
Resin Designs
Substrate:
Copper; Dissimilar metal surfaces; Nickel
9703
EMI/RFI shield; 1 Part; Transfer tape; Acrylic; Pressure Sensitive;
Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically
conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films • ;
Manufacturer:
3M
Substrate:
Aluminum; Copper; FR-4 epoxy; Gold; Metals; polyimide; Stainless Steel
5420
Gasketing of EMI/RF shielded enclosures; 1 Part; Paste; Silicone; Heat;
Used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.;
Manufacturer:
Henkel
Substrate:
Cobalt; Copper; Iron; Magnesium; Nickel; Steel; Zinc
TF E2213F
EMI/RFI grounding; 1 Part; B-Staged Film; Epoxy; Heat;
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. ;
Manufacturer:
Resin Designs
Substrate:
Aluminum; Gold, Gold plated substrates; Nickel
9712
EMI/RFI shield; 1 Part; Tape; Filled Acrylic; Pressure Sensitive;
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.;
Manufacturer:
3M
Substrate:
Aluminum; Copper; EMI/RFI gasket attachment to metal surfaces; PVC, PVC laminates; Stainless Steel
9713
EMI/RFI shield; 1 Part; Tape; Filled Acrylic; Pressure Sensitive;
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.;
Manufacturer:
3M
Substrate:
Aluminum; Copper; EMI/RFI gasket attachment to metal surfaces; Metal surfaces; PVC, PVC laminates; Stainless Steel
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