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ThermoSink 35-1

Gap Filler; 2 Part; Liquid; Silicone; 2-Part Cure;
A two-component, flowable, thermally conductive silicone elastomer that cures rapidly at room temperature. It is designed for electrical potting and/or thermal interfacial applications where high-performance thermal management is required.;
Manufacturer: Resin Designs
Substrate: Ceramic; Engineered Plastic; Glass; Metal

Aluminium Minute Adhesive

Gap filling; 2 Part; Liquid; Epoxy; 2-Part Cure;
An odourless, two-component epoxy adhesive filled with aluminium. It cures fast at room temperature and practically without shrinkage. After curing, the adhesive can be machined (filing, drilling, milling).;
Manufacturer: WEICON
Substrate: Aluminum, Alu sandblasted; Other light metals; PVC hard-roughened ; Steel sand blasted

CoolTherm SC-1200 Thermally Conductive Silicone Gap Filler

Gap Filler; 2 Part; Paste; Silicone; 2-Part Cure;
A two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.;

Chem-Calk 600

Spacer shims; 1 Part; Paste; Acrylic; Pressure Sensitive;
One-component acrylic latex compound; non-sag; easy gunnability and tooling; mold and mildew resistance and outstanding flexibility.;

CoolTherm SC-1500 Thermally Conductive Silicone Gap Filler

Gap Filler; 2 Part; Paste; Silicone; 2-Part Cure;
A two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones. ;

Dowsil TC-4525 Thermally Conductive Gap Filler

Thermally Conductive Gap Filler; 2 Part; Liquid; Silicone; 2-Part Cure;
Thermally conductive silicone gap filler material for automotive electronics, two part material curing at room temperature.;

Loctite 660

Fills gaps up to 0.020" diametral clearance; 1 Part; Paste; Urethane methacrylate; Anaerobic;
A creamy, non-running adhesive/sealant. Repairs worn machine parts. Restores correct fit to mating assemblies. Fills gaps up to 0.020" diametral clearance.;
Manufacturer: Henkel
Substrate: Metal; Steel, Steel pins and collars; Zinc Dichromate

Dowsil TC-4525 GB Thermally Conductive Gap Filler

Gap Filler ; 2 Part; Liquid; Silicone; 2-Part Cure;
2.5 W/m·K Silicone Gap Filler material for automotive applications, Glass Beads option (180 micron), two part material curing at room temperature.;

Bergquist Gap Pad TGP 3500ULM

Gap filling material; 1 Part; Pad; Silicone; Pressure Sensitive;
Highly conformable, thermally conductive, Ultra-Low Modulus Material, Fiberglass reinforced for shear and tear resistance.;
Manufacturer: Henkel
Substrate: Fiberglass

TIA222G Thermally Conductive Silicone

Gap filling; 2 Part; Liquid; Silicone; Heat;
Momentive TIA222G Thermally Conductive Silicone is a 2 Part Heat Silicone Liquid used to Pot and Encapsulate ;

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Gap Filler

;

Potting

2 Part

Liquid

Ceramic

;

Engineered Plastic

;

Glass

;

Metal

Order Sample

Gap filling

;

Bond

;

Repairing

2 Part

Liquid

Aluminum, Alu sandblasted

;

Other light metals

;

PVC hard-roughened

;

Steel sand blasted

Order Sample

Gap Filler

2 Part

Paste

Order Sample

Spacer shims

;

Seal

1 Part

Paste

Order Sample

Gap Filler

2 Part

Paste

Order Sample

Thermally Conductive Gap Filler

2 Part

Liquid

Order Sample

Fills gaps up to 0.020" diametral clearance

;

Bond

;

Repair

;

Seal

1 Part

Paste

Metal

;

Steel, Steel pins and collars

;

Zinc Dichromate

Order Sample

Gap Filler

2 Part

Liquid

Order Sample

Gap filling material

;

Gap Pad

;

TIM (Thermal Interface Material)

1 Part

Pad

Fiberglass

Order Sample

Gap filling

;

Encapsulating

;

Potting

2 Part

Liquid

Order Sample
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