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TP-1560 Thermally Conductive Pad
Gap Pad; 1 Part; Pad; Silicone; Low Pressures;
Thin thermal interface; fiberglass reinforced; one side tacky.;
Manufacturer:
Resin Designs
TP-1562 Thermal Pad
Gap Pad; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
TP-2200HP Thermal Pad
Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
TP-2260HP Thermal Pad
Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
TP-2860 Thermal Pad
Gap Pad; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
TP-3500 Thermal Pad
Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
TP-3500-SOFT Thermal Pad
Thin; 1 Part; Gel; Flame retardant; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
TP-3560-SOFT Thermal Pad
Gap Pad; 1 Part; Gel; Silicone; None;
Long-term, reliable protection of sensitive circuits and components is important in today's delicate and
demanding electronic applications.;
Manufacturer:
Resin Designs
Gap Pad 2200SF
Thermally Conductive Gap Filling Material; 1 Part; Pad; Silicone-Free; Pressure-Sensitive;
Thermally conductive, silicone-free gap filling material, electrically isolating;
Manufacturer:
Henkel
Bergquist Gap Pad TGP HC5000
Gap Pad; 1 Part; Pad; Silicone; None;
Highly Conformable, Thermally Conductive, Low Modulus Material. A soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The enhanced material is ideal for applications requiring low stress on components and boards during assembly;
Manufacturer:
Henkel
Substrate:
Bulk Rubber; Fiberglass
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