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TP-1560 Thermally Conductive Pad

Gap Pad; 1 Part; Pad; Silicone; Low Pressures;

Thin thermal interface; fiberglass reinforced; one side tacky.;

Manufacturer: Resin Designs

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TP-1562 Thermal Pad

Gap Pad; 1 Part; Gel; Flame retardant; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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TP-2200HP Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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TP-2260HP Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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TP-2860 Thermal Pad

Gap Pad; 1 Part; Gel; Flame retardant; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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TP-3500 Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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TP-3500-SOFT Thermal Pad

Thin; 1 Part; Gel; Flame retardant; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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TP-3560-SOFT Thermal Pad

Gap Pad; 1 Part; Gel; Silicone; None;

Long-term, reliable protection of sensitive circuits and components is important in today's delicate and demanding electronic applications.;

Manufacturer: Resin Designs

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Gap Pad 2200SF

Thermally Conductive Gap Filling Material; 1 Part; Pad; Silicone-Free; Pressure-Sensitive;

Thermally conductive, silicone-free gap filling material, electrically isolating;

Manufacturer: Henkel

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Bergquist Gap Pad TGP HC5000

Gap Pad; 1 Part; Pad; Silicone; None;

Highly Conformable, Thermally Conductive, Low Modulus Material. A soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The enhanced material is ideal for applications requiring low stress on components and boards during assembly;

Manufacturer: Henkel

Substrate: Bulk Rubber; Fiberglass

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	Manufacturer \| Material About these rankings

	Manufacturer \| Material About these rankings	Application Type	1 Part or 2 Part	Material Form	Substrate	Show More +

	TP-1560 Thermally Conductive Pad
	TP-1562 Thermal Pad
	TP-2200HP Thermal Pad
	TP-2260HP Thermal Pad
	TP-2860 Thermal Pad
	TP-3500 Thermal Pad
	TP-3500-SOFT Thermal Pad
	TP-3560-SOFT Thermal Pad
	Gap Pad 2200SF
	Bergquist Gap Pad TGP HC5000

	TP-1560 Thermally Conductive Pad	Gap Pad	1 Part	Pad		Order Sample
	TP-1562 Thermal Pad	Gap Pad	1 Part	Gel		Order Sample
	TP-2200HP Thermal Pad	Thin	1 Part	Gel		Order Sample
	TP-2260HP Thermal Pad	Thin	1 Part	Gel		Order Sample
	TP-2860 Thermal Pad	Gap Pad	1 Part	Gel		Order Sample
	TP-3500 Thermal Pad	Thin	1 Part	Gel		Order Sample
	TP-3500-SOFT Thermal Pad	Thin	1 Part	Gel		Order Sample
	TP-3560-SOFT Thermal Pad	Gap Pad	1 Part	Gel		Order Sample
	Gap Pad 2200SF	Thermally Conductive Gap Filling Material	1 Part	Pad		Order Sample
	Bergquist Gap Pad TGP HC5000	Gap Pad ; Thermal Interface Material	1 Part	Pad	Bulk Rubber ; Fiberglass	Order Sample

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