A two-component, flowable, thermally conductive silicone elastomer that cures rapidly at room temperature. It is designed for electrical potting and/or thermal interfacial applications where high-performance thermal management is required.;
Encapsulate; Two Part; Liquid; Epoxy; 2-Part Cure;
A two part unfilled epoxy encapsulant designed for medium sized castings, a tough, semi-rigid polymer, a good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release, very good resistance, high elongation.;
Encapsulant; Two Part; Gel (Post-cure); Silicone; Part A/Part B;
Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.;
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