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9703
EMI/RFI shield; 1 Part; Transfer tape; Acrylic; Pressure Sensitive;
Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically
conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films • ;
Manufacturer:
3M
Substrate:
Aluminum; Copper; FR-4 epoxy; Gold; Metals; polyimide; Stainless Steel
5420
Gasketing of EMI/RF shielded enclosures; 1 Part; Paste; Silicone; Heat;
Used for automotive sensor bonding and gasketing of EMI/RF shielded enclosures.;
Manufacturer:
Henkel
Substrate:
Cobalt; Copper; Iron; Magnesium; Nickel; Steel; Zinc
TF E2213F
EMI/RFI grounding; 1 Part; B-Staged Film; Epoxy; Heat;
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. ;
Manufacturer:
Resin Designs
Substrate:
Aluminum; Gold, Gold plated substrates; Nickel
Loctite CC 40A E&C
Use in radar reflection; 1 Part; Liquid; Solvent based elastomer; Hot air drying;
● One component ● Electrically conductive ● Elastomeric ● Silver-filled ● Elastomeric surface coating ● use in a variety of electrical and electronic applications ● Hot air drying;
Manufacturer:
Henkel
9712
EMI/RFI shield; 1 Part; Tape; Filled Acrylic; Pressure Sensitive;
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.;
Manufacturer:
3M
Substrate:
Aluminum; Copper; EMI/RFI gasket attachment to metal surfaces; PVC, PVC laminates; Stainless Steel
9713
EMI/RFI shield; 1 Part; Tape; Filled Acrylic; Pressure Sensitive;
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.;
Manufacturer:
3M
Substrate:
Aluminum; Copper; EMI/RFI gasket attachment to metal surfaces; Metal surfaces; PVC, PVC laminates; Stainless Steel
1120 Tape
EMI/RFI shielding; 1 Part; Tape; Acrylic; Pressure-sensitive;
Used for applications requiring excellent electrical conductivity and is designed for EMI/RFI shielding and cable wrap.;
TF E2214F
EMI/RFI grounding; 1 Part; B-Staged Film; Epoxy; Heat;
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. ;
Manufacturer:
Resin Designs
Substrate:
Gold, Gold plated substrates
40-3900
RFI shielding; 2 Part; Paste; Epoxy; Resin/Hardener;
Epoxies Etc 40-3900 is a 2 Part Resin/Hardener Epoxy Paste used to Adhere Al;
TF E2313F
EMI/RFI grounding; 1 Part; Film; Epoxy; Heat;
A high performance, electrically conductive, B-Staged film adhesive developed for higher temperature applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates and good chemical, and thermal degradation resistance.;
Manufacturer:
Resin Designs
Substrate:
Aluminum; Ceramic; Glass
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