Armstrong A-12T Epoxy Resin
Bond; 2-Part; Paste; Epoxy; Part A/Part B;
Two-part epoxy based formulation; high strength, permanent bonds, low shrinkage, excellent wetting characteristics, non-critical mix ratio can vary to obtain a more flexible or rigid bond. .;
Armstrong C-7 Epoxy Resin w/ Activator A
Bond; 2-Part; Liquid; Epoxy; 2 Parts;
An adhesive with a very rigid glue line. Although these systems do not exhibit high tensile shear strengths, they have proven very useful where a rigidity is required - such as bonding strain gages transducers and other strain measuring elements. Activator A is fast reacting and cure is at room temperature.
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Armstrong C-7 w/ Activator E
Bonding; 2-Part; Liquid; Epoxy; Heat cure;
A low viscosity epoxy adhesive system designed to cure with heat. Once cured it produces an adhesive with a very rigid bond line. Exceptionally good chemical and solvent resistance.;
Armstrong A-661
Bond; 2-Part; Paste; Epoxy; Room temperature curing;
A two-part, smooth, brushable, non-sag, room temperature curing adhesive that produces bonds with excellent shear strength. Easy to apply paste that cures to handling strength overnight at room temperature.;
Armstrong A-271
Bonding; 2-Part; Liquid; Epoxy; 2-Part Cure;
An amber-colored clear two-part epoxy bonding adhesive, good adhesion to glass due to its wetting ability, good moisture and chemical resistance.;
Armstrong A-12 Epoxy Resin 3:2
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure;
A general purpose adhesive, combines low toxicity with good physical properties. This two-part adhesive has a non-critical mixing ratio with 1:1 used most frequently. The mix ratio can be varied to obtain a more flexible or more rigid bond by increasing or decreasing respectively, the concentration of Part B.;
Armstrong C-4 Epoxy Resin w/ Activator W
Bond; 2-Part; Liquid; Epoxy; Resin/Activator;
Activator "W" is a curing agent for epoxy resins and has a wide range of applications. C-4 with Activator "W" has excellent adhesion to such materials as rubber, thermosetting plastics, most thermoplastics, concrete, ceramics, glass, all metals and many others.;
Armstrong A-706 Epoxy Resin Adhesive
Bond; 1-Part; Liquid; Epoxy resin; Heat cure;
A one component, consists of an epoxy resin and inert filler, contains metallic aluminum fillers imparting excellent room temperature tensile strength and machining properties.;
Armstrong A-2 Epoxy Resin w/ A Activator
Bond; 2-Part; Paste; Epoxy; 2 Parts;
An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.;
Armstrong A-701 Epoxy Resin
Bond; 1-Part; Liquid; Epoxy; Heat cure;
One-component epoxy adhesives which are cured by the application of heat above 350°F. Good chemical
resistance. It contains fillers of the inert oxide type, permitting applications where good electrical resistance.;