This is a silicone encapsulant defined by its transparency, wide usable temperature range and ability to effectively encapsulate nearly all porous and nonporous substrates. The versatility and user-friendliness of Dow 184 make it a go-to choice across many types of manufacturing.
What makes 454 unique is that it is a high-viscosity thixotropic gel rather than a water-thin, low-viscosity option, which gives it gap-filling capability
Special considerations must be taken when selecting the ideal electrically conductive tapes for EMI shielding of extremely high-frequency applications, such as in 5G radio electronics in the millimeter bands or mmWave. Read more >
The mixing, blending and manufacturing of chemicals isn’t the end of the road. Proper chemical packaging is an essential step in your process.
Low-pressure molding is vital for protecting sensitive electronic components against the environment, like moisture, dust and dirt. As an alternative to high-pressure molding, it allows for overmolding on more sensitive equipment.