Glass beads are added to adhesives to control bond-line thickness. They have a relatively uniform size that typically ranges from 1 to 10 mil in diameter; however, some applications use spacer beads as large as 20 or 30 mil.

Fisnar’s DC100 MAX High Precision dispenser is designed to achieve high levels of process stability in fluid dispensing applications. Gluespec asked Robert Campbell, Fisnar’s Global Product Manager, about this benchtop unit and how its precision, functionality, and connectivity are helping manufacturers to improve production.

For engineers who need help with product selection, this Q&A from Gluespec® provides answers to frequently asked questions (FAQs) about industrial cleaners.

Semiconductor packaging adhesives are used to attach dies or chips to the substrates on which semiconductor devices are packaged or fabricated.. Learn more about the adhesive selection process and common problems and solutions.

The best way to get two things to stick together with glue is to use adhesive primers or an adhesive promotor. You can also roughen the surface, etch the surface, or use plasma, flame, or corona surface treatments. But which is best for you? Find out here >>