Bergquist Sil Pad TSP Q2000
Glass-Reinforced Thermal Interface; 1-Part; Die-cut parts; Silicone; Pressure-Sensitive;
Glass-Reinforced Grease Replacement Thermal Interface;
Bergquist Sil Pad TSP K1300
Sil pad; 1-Part; Pad; Reinforcement carrier - Kapton-; Pressure-sensitive;
The high performance kapton based Insulator. Silicone, beige appearance. Thermally conductive adhesive. Operating temperature range -60 to 180ºC.;
Bergquist Sil Pad TSP 1100ST
Thermal Interface Material; 1-Part; Roll Form; Silicone; Pressure Sensitive;
Electrically insulating, thermally conductive, fiberglass reinforced thermal interface material featuring inherent tack on both sides.;
Bergquist Sil Pad TSP Q2500
Sil Pad; 1-Part; Pad; Silicone; Pressure-Sensitive;
• One-part • Black • Silicone • Thermally conductive • Heat transfer • Sil Pad.;
Bond Ply 800
Bond; 1-Part; Tape; Acrylic; Pressure sensitive;
A thermally conductive, electrically isolating double-sided tape and High bond strength.;
Bergquist Sil Pad TSP 1800
Sil Pad; 1-Part; Slit-to-width Roll form; Fiberglass-reinforced; Pressure-Sensitive;
A silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface.;
Bergquist Liqui Bond TLB SA2000
Adhesive; 1-Part; Liquid; Silicone; Heat;
Thermally Conductive, One-Part, Liquid Silicone Adhesive, Heat Cure;
Bergquist Gap Pad TGP 1500
Thermally Conductive Gap Filling Material; 1-Part; Pad; Silicone; Pressure-Sensitive;
A thermally conductive, un-reinforced gap filling material. Ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.;
Bergquist Gap Pad TGP EMI1000
Gap pad; 1-Part; Pad; Fiberglass - reinforcement carrier; Pressure sensitive;
A silicone, black appearance, fiberglass reinforcement carrier. It is a highly conformable, combination gap filling material offering both thermal conductivity performance.;
Bergquist Liqui Form TLF 3500CGEL
TIM (Thermal interface material); 1-Part; Gel; Silicone; Heat;
A one part, high performance, thermally conductivity curable gel designed for demanding high reliability applications. The material will cure from within the application, at room temperature. Cure can be accelerated with the addition of heat.;