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Bergquist Sil Pad TSP Q2000

Glass-Reinforced Thermal Interface; 1-Part; Die-cut parts; Silicone; Pressure-Sensitive;
Glass-Reinforced Grease Replacement Thermal Interface;
Manufacturer: Henkel
Brand: Bergquist; Sil Pad

Bergquist Sil Pad TSP K1300

Sil pad; 1-Part; Pad; Reinforcement carrier - Kapton-; Pressure-sensitive;
The high performance kapton based Insulator. Silicone, beige appearance. Thermally conductive adhesive. Operating temperature range -60 to 180ºC.;

Bergquist Sil Pad TSP 1100ST

Thermal Interface Material; 1-Part; Roll Form; Silicone; Pressure Sensitive;
Electrically insulating, thermally conductive, fiberglass reinforced thermal interface material featuring inherent tack on both sides.;
Manufacturer: Henkel
Brand: Bergquist; Sil Pad

Bergquist Sil Pad TSP Q2500

Sil Pad; 1-Part; Pad; Silicone; Pressure-Sensitive;
• One-part • Black • Silicone • Thermally conductive • Heat transfer • Sil Pad.;
Manufacturer: Henkel
Brand: Bergquist; Sil Pad

Bond Ply 800

Bond; 1-Part; Tape; Acrylic; Pressure sensitive;
A thermally conductive, electrically isolating double-sided tape and High bond strength.;

Bergquist Sil Pad TSP 1800

Sil Pad; 1-Part; Slit-to-width Roll form; Fiberglass-reinforced; Pressure-Sensitive;
A silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface.;

Bergquist Liqui Bond TLB SA2000

Adhesive; 1-Part; Liquid; Silicone; Heat;
Thermally Conductive, One-Part, Liquid Silicone Adhesive, Heat Cure;
Manufacturer: Henkel
Brand: Bergquist
Chemical Resistance: Chemical stability

Bergquist Gap Pad TGP 1500

Thermally Conductive Gap Filling Material; 1-Part; Pad; Silicone; Pressure-Sensitive;
A thermally conductive, un-reinforced gap filling material. Ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.;

Bergquist Gap Pad TGP EMI1000

Gap pad; 1-Part; Pad; Fiberglass - reinforcement carrier; Pressure sensitive;
A silicone, black appearance, fiberglass reinforcement carrier. It is a highly conformable, combination gap filling material offering both thermal conductivity performance.;

Bergquist Liqui Form TLF 3500CGEL

TIM (Thermal interface material); 1-Part; Gel; Silicone; Heat;
A one part, high performance, thermally conductivity curable gel designed for demanding high reliability applications. The material will cure from within the application, at room temperature. Cure can be accelerated with the addition of heat.;
Manufacturer: Henkel
Brand: Bergquist
Chemical Resistance: Chemical stability

Bergquist Sil Pad TSP Q2000

Glass-Reinforced Thermal Interface; 1-Part; Die-cut parts; Silicone; Pressure-Sensitive
Glass-Reinforced Grease Replacement Thermal Interface
Manufacturer: Henkel
Brand: Bergquist; Sil Pad

Bergquist Sil Pad TSP K1300

Sil pad; 1-Part; Pad; Reinforcement carrier - Kapton-; Pressure-sensitive
The high performance kapton based Insulator. Silicone, beige appearance. Thermally conductive adhesive. Operating temperature range -60 to 180ºC.
Manufacturer: Henkel
Brand: Bergquist

Bergquist Sil Pad TSP 1100ST

Thermal Interface Material; 1-Part; Roll Form; Silicone; Pressure Sensitive
Electrically insulating, thermally conductive, fiberglass reinforced thermal interface material featuring inherent tack on both sides.
Manufacturer: Henkel
Brand: Bergquist; Sil Pad

Bergquist Sil Pad TSP Q2500

Sil Pad; 1-Part; Pad; Silicone; Pressure-Sensitive
• One-part • Black • Silicone • Thermally conductive • Heat transfer • Sil Pad.
Manufacturer: Henkel
Brand: Bergquist; Sil Pad

Bond Ply 800

Bond; 1-Part; Tape; Acrylic; Pressure sensitive
A thermally conductive, electrically isolating double-sided tape and High bond strength.
Manufacturer: Henkel
Brand: Bergquist

Bergquist Sil Pad TSP 1800

Sil Pad; 1-Part; Slit-to-width Roll form; Fiberglass-reinforced; Pressure-Sensitive
A silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface.
Manufacturer: Henkel
Brand: Bergquist

Bergquist Liqui Bond TLB SA2000

Adhesive; 1-Part; Liquid; Silicone; Heat
Thermally Conductive, One-Part, Liquid Silicone Adhesive, Heat Cure
Manufacturer: Henkel
Brand: Bergquist
Chemical Resistance: Chemical stability

Bergquist Gap Pad TGP 1500

Thermally Conductive Gap Filling Material; 1-Part; Pad; Silicone; Pressure-Sensitive
A thermally conductive, un-reinforced gap filling material. Ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.
Manufacturer: Henkel
Brand: Bergquist

Bergquist Gap Pad TGP EMI1000

Gap pad; 1-Part; Pad; Fiberglass - reinforcement carrier; Pressure sensitive
A silicone, black appearance, fiberglass reinforcement carrier. It is a highly conformable, combination gap filling material offering both thermal conductivity performance.
Manufacturer: Henkel
Brand: Bergquist

Bergquist Liqui Form TLF 3500CGEL

TIM (Thermal interface material); 1-Part; Gel; Silicone; Heat
A one part, high performance, thermally conductivity curable gel designed for demanding high reliability applications. The material will cure from within the application, at room temperature. Cure can be accelerated with the addition of heat.
Manufacturer: Henkel
Brand: Bergquist
Chemical Resistance: Chemical stability
Brand
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Bergquist Sil Pad TSP Q2000
Henkel
Bergquist; Sil Pad
Glass-Reinforced Thermal Interface
1-Part
Glass-Reinforced Grease Replacement Thermal Interface
Bergquist Sil Pad TSP K1300
Henkel
Bergquist
Adhesive; Sil pad
1-Part
The high performance kapton based Insulator. Silicone, beige appearance. Thermally conductive adhesive. Operating temperature range -60 to 180ºC.
Bergquist Sil Pad TSP 1100ST
Henkel
Bergquist; Sil Pad
Thermal Interface Material
1-Part
Electrically insulating, thermally conductive, fiberglass reinforced thermal interface material featuring inherent tack on both sides.
Bergquist Sil Pad TSP Q2500
Henkel
Bergquist; Sil Pad
Sil Pad; Thermal Interface Material
1-Part
• One-part • Black • Silicone • Thermally conductive • Heat transfer • Sil Pad.
Bond Ply 800
Henkel
Bergquist
Bond; Thermal Adhesive
1-Part
A thermally conductive, electrically isolating double-sided tape and High bond strength.
Bergquist Sil Pad TSP 1800
Henkel
Bergquist
Sil Pad; Thermal interface material
1-Part
A silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface.
Bergquist Liqui Bond TLB SA2000
Henkel
Bergquist
Chemical stability
Adhesive; TIM (Thermal Interface Material)
1-Part
Thermally Conductive, One-Part, Liquid Silicone Adhesive, Heat Cure
Bergquist Gap Pad TGP 1500
Henkel
Bergquist
Thermally Conductive Gap Filling Material
1-Part
A thermally conductive, un-reinforced gap filling material. Ideal filler blend that gives it a low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling.
Bergquist Gap Pad TGP EMI1000
Henkel
Bergquist
Electromagnetic lnterference (EMI) absorbing; Gap pad; TIM (thermal interface material)
1-Part
A silicone, black appearance, fiberglass reinforcement carrier. It is a highly conformable, combination gap filling material offering both thermal conductivity performance.
Bergquist Liqui Form TLF 3500CGEL
Henkel
Bergquist
Chemical stability
TIM (Thermal interface material)
1-Part
A one part, high performance, thermally conductivity curable gel designed for demanding high reliability applications. The material will cure from within the application, at room temperature. Cure can be accelerated with the addition of heat.
Manufacturer | Material
Brand Chemical Resistance Application Type 1 Part or 2 Part
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Bergquist

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Sil Pad

Glass-Reinforced Thermal Interface

1-Part

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Bergquist

Adhesive

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Sil pad

1-Part

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Bergquist

;

Sil Pad

Thermal Interface Material

1-Part

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Bergquist

;

Sil Pad

Sil Pad

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Thermal Interface Material

1-Part

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Bergquist

Bond

;

Thermal Adhesive

1-Part

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Bergquist

Sil Pad

;

Thermal interface material

1-Part

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Bergquist

Chemical stability

Adhesive

;

TIM (Thermal Interface Material)

1-Part

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Bergquist

Thermally Conductive Gap Filling Material

1-Part

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Bergquist

Electromagnetic lnterference (EMI) absorbing

;

Gap pad

;

TIM (thermal interface material)

1-Part

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Bergquist

Chemical stability

TIM (Thermal interface material)

1-Part

Order Sample