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Loctite Ablestik 104
Bond; 2-Part; Paste; Epoxy; Heat;
● Black liquid ● Two component - requires mixing ● Excellent chemical resistance ● Non-conductive
● High shear strength ● High temperature resistance ● Long pot life ● Heat cure;
Manufacturer:
Henkel
Brand:
Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Chemical Resistance:
Excellent
Loctite Ablestik 56C w/ Cat 11
Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure;
Two component, high temperature, general purpose. Adhesive - Electrically Conductive;
Manufacturer:
Henkel
Brand:
Eccobond; Ablestik; Emerson & Cuming; Loctite
Chemical Resistance:
Excellent
Loctite Stycast AC 0305
Thinner; 1-Part; Liquid; Solvent-based; Solvent;
Under some conditions of use, Hysol® printed circuit coatings may require adjustment of viscosity and/or film thickness, this can be done by adding solvent. AC0305™ is a special blend of solvents designed to give moderately slow evaporation.;
Manufacturer:
Henkel
Brand:
Eccobond; Hysol; Loctite; Stycast
Loctite Ablestik CT 5047-2
Bond; 2-Part; Paste (Comp. A); Epoxy; Heat;
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive;
Manufacturer:
Henkel
Brand:
Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Loctite Ablestik 45 w/ Catalyst 15
Bond; 2-Part; Liquid; Epoxy; Room Temperature Cure;
A general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to plastic. It is designed for use where shock and peel resistance are desired.
;
Manufacturer:
Henkel
Brand:
Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Loctite Ablestik 286
Bond; 2-Part; Paste; 2-Part Cure;
A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting. ;
Manufacturer:
Henkel
Brand:
Eccobond; Ablestik; Emerson & Cuming; Loctite
Eccobond E3200
Bond; 1-Part; Thixotropic Paste; Epoxy; Heat;
• Fast and low temperature cure • Sag resistant paste • Resilient • Flexible epoxy • Excellent chemical and humidy resistance • Non-conductive • Heat cure;
Manufacturer:
Henkel
Brand:
Eccobond
; Emerson & Cuming; Hysol
Chemical Resistance:
Excellent
Eccobond 55
Bond; 2-Part; Liquid; Epoxy; Heat;
An unfilled, low viscosity, general purpose epoxy adhesive resin that can be cured with a variety of catalysts.;
Manufacturer:
Henkel
Brand:
Eccobond
Chemical Resistance:
Excellent chemical resistance; Good Solvent Resistance; Good Water Resistance
Loctite Ablestik 45LV w/ CAT 15LV
Bond; 2-Part; Liquid; Epoxy; Heat Cure;
● Two components ● Epoxy ● Room Temperature Cure ● Heat Cure ● Low viscosity ● General purpose ● Variable flexibility;
Manufacturer:
Henkel
Brand:
Eccobond; Ablestik; Emerson & Cuming; Loctite
Loctite 3128
Bond; 1-Part; Liquid; Epoxy; Heat;
A one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time.;
Manufacturer:
Henkel
Brand:
Eccobond; Loctite
Chemical Resistance:
Solvent resistance
Loctite Ablestik 104
Bond; 2-Part; Paste; Epoxy; Heat
● Black liquid ● Two component - requires mixing ● Excellent chemical resistance ● Non-conductive
● High shear strength ● High temperature resistance ● Long pot life ● Heat cure
Manufacturer: Henkel
Brand: Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Chemical Resistance: Excellent
Loctite Ablestik 56C w/ Cat 11
Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
Manufacturer: Henkel
Brand: Eccobond; Ablestik; Emerson & Cuming; Loctite
Chemical Resistance: Excellent
Loctite Stycast AC 0305
Thinner; 1-Part; Liquid; Solvent-based; Solvent
Under some conditions of use, Hysol® printed circuit coatings may require adjustment of viscosity and/or film thickness, this can be done by adding solvent. AC0305™ is a special blend of solvents designed to give moderately slow evaporation.
Loctite Ablestik CT 5047-2
Bond; 2-Part; Paste (Comp. A); Epoxy; Heat
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
Manufacturer: Henkel
Brand: Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Loctite Ablestik 45 w/ Catalyst 15
Bond; 2-Part; Liquid; Epoxy; Room Temperature Cure
A general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to plastic. It is designed for use where shock and peel resistance are desired.
Manufacturer: Henkel
Brand: Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Loctite Ablestik 286
Bond; 2-Part; Paste; 2-Part Cure
A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting.
Manufacturer: Henkel
Brand: Eccobond; Ablestik; Emerson & Cuming; Loctite
Eccobond E3200
Bond; 1-Part; Thixotropic Paste; Epoxy; Heat
• Fast and low temperature cure • Sag resistant paste • Resilient • Flexible epoxy • Excellent chemical and humidy resistance • Non-conductive • Heat cure
Manufacturer: Henkel
Brand: Eccobond
; Emerson & Cuming; Hysol
Chemical Resistance: Excellent
Eccobond 55
Bond; 2-Part; Liquid; Epoxy; Heat
An unfilled, low viscosity, general purpose epoxy adhesive resin that can be cured with a variety of catalysts.
Manufacturer: Henkel
Brand: Eccobond
Chemical Resistance: Excellent chemical resistance; Good Solvent Resistance; Good Water Resistance
Loctite Ablestik 45LV w/ CAT 15LV
Bond; 2-Part; Liquid; Epoxy; Heat Cure
● Two components ● Epoxy ● Room Temperature Cure ● Heat Cure ● Low viscosity ● General purpose ● Variable flexibility
Manufacturer: Henkel
Brand: Eccobond; Ablestik; Emerson & Cuming; Loctite
Package Sizes
Resin Black 12 lb
Loctite 3128
Bond; 1-Part; Liquid; Epoxy; Heat
A one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time.
Manufacturer: Henkel
Brand: Eccobond; Loctite
Chemical Resistance: Solvent resistance
Brand
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Excellent
Bond
2-Part
● Black liquid ● Two component - requires mixing ● Excellent chemical resistance ● Non-conductive
● High shear strength ● High temperature resistance ● Long pot life ● Heat cure
Eccobond; Ablestik; Emerson & Cuming; Loctite
Excellent
Bond
2-Part
Two component, high temperature, general purpose. Adhesive - Electrically Conductive
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
Resin 113 g Resin 454 g Catalyst Brown 4 oz Catalyst Brown 1 lb Catalyst 1 lb Mil-Spec Catalyst 40 lb
Eccobond; Hysol; Loctite; Stycast
Thinner
1-Part
Under some conditions of use, Hysol® printed circuit coatings may require adjustment of viscosity and/or film thickness, this can be done by adding solvent. AC0305™ is a special blend of solvents designed to give moderately slow evaporation.
Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Bond
2-Part
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
Part A 500 g Part B 10 g Part B 25 g Part B 50 g Part A 250 g Part A 125 g
Eccobond; Ablestik; Emerson & Cuming; Hysol; Loctite
Bond
2-Part
A general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to plastic. It is designed for use where shock and peel resistance are desired.
Eccobond; Ablestik; Emerson & Cuming; Loctite
Bond
2-Part
A two component, thermally conductive, room temperature curing, epoxy adhesive. The proper amount of thixotropy is built in to assure minimum flow without sacrificing wetting.
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
Part A White 12 oz Part A White 4 lb Gal Part A White 20 lb Pail Part B 1 lb 5 oz Part B 7 lb Gal Part B 35 lb Pail
Eccobond
; Emerson & Cuming; Hysol
Excellent
Bond
1-Part
• Fast and low temperature cure • Sag resistant paste • Resilient • Flexible epoxy • Excellent chemical and humidy resistance • Non-conductive • Heat cure
Eccobond
Excellent chemical resistance; Good Solvent Resistance; Good Water Resistance
Bond
2-Part
An unfilled, low viscosity, general purpose epoxy adhesive resin that can be cured with a variety of catalysts.
Eccobond; Ablestik; Emerson & Cuming; Loctite
Bond
2-Part
● Two components ● Epoxy ● Room Temperature Cure ● Heat Cure ● Low viscosity ● General purpose ● Variable flexibility
Eccobond; Loctite
Solvent resistance
Bond
1-Part
A one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time.
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