Technomelt PA 638 Black
Encapsulation; 1-Part; Pellet; Polyamide; Hotmelt;
A one-component, used for molding applications.;
Technomelt PA 678 Black
Encapsulation; 1-Part; Pellet; Physical setting; Hot melt;
Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood.;
Technomelt PA 633 (e)
Easy moldability; 1-Part; Pellets; Thermoplastic polyamide; Hot Melt;
● Molding compound thermoplastic ● Encapsulation ● Easy moldability ● Good adhesion to a variety of substrates ● Excellent moisture resistance ● Excellent environmental resistance ● Simplified process flow;
Technomelt PA 687
Molding compound thermoplastic; 1-Part; Pellets; Polyamide; Hot melt;
Moldable polyamide for the most demanding high humidity applications such as on the inside of an automobile tire. Formulated for very low water vapor transmission.;
MM-6211
Bond; 1-Part; Stick; Polyamide Hot Melt; Hotmelt;
A polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and ABS.;
Technomelt AS 5375
Bond; 1-Part; Granules; Physical setting;
One-component, polyolefin hot melt, used for general assembly applications. It is specially formulated for bonding and coating polypropylene or similar polyolefins.;
Macromelt OM 681
Mold; 1-Part; Pellets; No Toxic Fumes; Hot melt;
Good adhesion to various substrates and provide an excellent moisture and environmental seal.;
Technomelt PA 682 (e)
Encapsulation; 1-Part; Pellets; Polyamide; Hot melt;
Hot melt adhesive is designed for molding compound applications., Polyamide, Amber, Molding compound thermoplastic, Encapsulation, Operating Temperature -40 to 150 °C;
Macromelt OM 686
Mold; 1-Part; Pellets; Hot melt; Hot melt;
The Macromelt® line of high performance thermoplastic polyamides is specially designed to meet all your molding process requirements. These products provide good adhesion to various substrates;
Technomelt PA 646 Black
Bond; 1-Part; Pellet; Polyamide; Physical setting;
A one-component polyamide hot melt adhesive designed to meet low pressure molding process requirements. This product can be processed at low molding pressure due to its low viscosity, allowing encapsulation of fragile components without damage.;