5952
Pot/Encapsulate; 2-Part; Liquid; Silicone; 2-Part Cure;
A filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties, a convenient mix ratio and can be cured over a wide range of temperatures.;
Stycast 3050 w/ Catalyst 11
Pot/Encapsulate; 2-Part; Liquid; Epoxy; Heat;
A filled, very low viscosity, epoxy encapsulant resin which can be cured with a variety of catalysts. The filler system is non-abrasive and readily machinable.;
Loctite Stycast 5954
Encapsulate; 2-Part; Liquid; Silicone; Part A/Part B;
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant
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Loctite Stycast 1265
Encapsulate; 2-Part; Liquid; Epoxy; Part A/Part B;
It is a clear, two component soft gel, epoxy encapsulant. It is tough, has hardness and a long pot life. It may be used as a flexible adhesive, excellent adhesion to a wide variety of substrates.;
Loctite Stycast UV 7993
Conformal Coating; 1-Part; Liquid; Solvent-free; UV curable;
A conformal coating designed to provide rugged protection from moisture and harsh chemicals.;
Stycast 3050 w/ Catalyst 9
Pot/Encapsulate; 2-Part; Liquid; Epoxy; Heat;
A filled, very low viscosity, epoxy encapsulant resin which can be cured with a variety of catalysts. The filler system is non-abrasive and readily machinable.;
Loctite Stycast AC 0305
Thinner; 1-Part; Liquid; Solvent-based; Solvent;
Under some conditions of use, Hysol® printed circuit coatings may require adjustment of viscosity and/or film thickness, this can be done by adding solvent. AC0305™ is a special blend of solvents designed to give moderately slow evaporation.;
Stycast W 66
Encapsulate; 2-Part; Liquid; Epoxy; 2 Parts;
• High Temperature Epoxy Impregnant • High temperature resistance • Excellent chemical resistance • Long term electrical service up to 220°C • Assembly can survive harsh chemical exposure •
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Stycast 2741 LV w/ Catalyst 15 LV
Encapsulant; 2-Part; Liquid; Epoxy; 2 Parts;
Black filled room temperature curing epoxy encapsulant. It has excellent shock and impact resistance and excellent adhesion to glass, metals, plastics and ceramics.;
Stycast 2851 FT
Encapsulate; 1-Part; Liquid; Epoxy; Heat;
• One Component • Good thermal conductivity • Low coefficient of thermal expansion • Heat cured • Epoxy encapsulant
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