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RTK7659
Bond; 1-Part; Liquid; Epoxy; Heat;
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.;
Manufacturer:
AI Technology
PRIMA-SOLDER ME8452
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.;
Manufacturer:
AI Technology
PRIMA-BOND ME7155-AN
Bonding; 1-Part; Paste; Epoxy; Heat;
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
Manufacturer:
AI Technology
PRIMA-BOND ME7159
Bond; 1-Part; Paste; Epoxy; Heat;
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
Manufacturer:
AI Technology
THERMOPLASTIC FILM TP7855
Bond; 1-Part; Film; Thermoplastic; Ambient Temp;
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.;
Manufacturer:
AI Technology
PRIMA-BOND ME7155-3
Bonding; 1-Part; Paste; Epoxy; Heat;
Epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components.;
Manufacturer:
AI Technology
PRIMA-SOLDER ME8155-M
Solder; 1-Part; Paste; Solvent free; Heat;
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.;
Manufacturer:
AI Technology
PRIMA-SOLDER ME8418
Bond; 1-Part; Paste; Solvent-Free; Snap-Curing;
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive;
Manufacturer:
AI Technology
COOL-BOND CB7208-EDA2
Bond; 1-Part; Liquid
; Epoxy; Elevated temperature;
A modified version of TP7208 designed to have improved bond strength at elevated temperature.;
Manufacturer:
AI Technology
PRIMA-BOND ME7158
Bonding; 1-Part; Paste; Epoxy; Heat cure;
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having mismatched CTE's (i.e., alumina to aluminum, silicon to copper).;
Manufacturer:
AI Technology
RTK7659
Bond; 1-Part; Liquid; Epoxy; Heat
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.
Manufacturer: AI Technology
PRIMA-SOLDER ME8452
Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.
Manufacturer: AI Technology
PRIMA-BOND ME7155-AN
Bonding; 1-Part; Paste; Epoxy; Heat
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology
PRIMA-BOND ME7159
Bond; 1-Part; Paste; Epoxy; Heat
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology
THERMOPLASTIC FILM TP7855
Bond; 1-Part; Film; Thermoplastic; Ambient Temp
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.
Manufacturer: AI Technology
PRIMA-BOND ME7155-3
Bonding; 1-Part; Paste; Epoxy; Heat
Epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components.
Manufacturer: AI Technology
PRIMA-SOLDER ME8155-M
Solder; 1-Part; Paste; Solvent free; Heat
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.
Manufacturer: AI Technology
PRIMA-SOLDER ME8418
Bond; 1-Part; Paste; Solvent-Free; Snap-Curing
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive
Manufacturer: AI Technology
COOL-BOND CB7208-EDA2
Bond; 1-Part; Liquid
; Epoxy; Elevated temperature
A modified version of TP7208 designed to have improved bond strength at elevated temperature.
Manufacturer: AI Technology
PRIMA-BOND ME7158
Bonding; 1-Part; Paste; Epoxy; Heat cure
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
Manufacturer: AI Technology
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
AI Technology
Bond
1-Part
A tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier.
AI Technology
Bond
1-Part
A reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive.
AI Technology
Bonding
1-Part
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
AI Technology
Bond
1-Part
A reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
AI Technology
Bond
1-Part
An alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate.
AI Technology
Bonding
1-Part
Epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components.
AI Technology
Bond; Solder
1-Part
A version of ME8155 modified to provide extra flexibility while maintaining all electrical and bond strength. It is a reworkable, solvent free, silver filled paste that is electrically and thermally conductive.
AI Technology
Bond
1-Part
Designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive
AI Technology
Bond
1-Part
A modified version of TP7208 designed to have improved bond strength at elevated temperature.
AI Technology
Bonding
1-Part
A reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having mismatched CTE's (i.e., alumina to aluminum, silicon to copper).
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