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Electrically Conductive Grease 57001
Grease; 1-Part; Grease; Non-Silicone-based; None;
A NON-SILICONE-based, chemically inert heat sink compound that is thermally stable.;
Manufacturer:
AOS Thermal Compounds
Chemical Resistance:
Chemically inert
Sure-Form Gap Filling Gel 52057
Gap Filling; 1-Part; Grease; Non-silicone; Moisture;
A one part, non-silicone, synthetic-based thermal grease.;
Manufacturer:
AOS Thermal Compounds
Non-Silicone HTC 52053
Gap filler; 1-Part; Paste; Non-silicone; Moisture;
A dispensable, one-part, non-silicone gap filler.;
Manufacturer:
AOS Thermal Compounds
Sure-Form 53
Gap filler; 1-Part; Paste; Non-silicone; Moisture cure;
A dispensable, one-part, non-silicone gap filler. Very tacky, very viscous, resists vibration and shock. Gray paste, will stay in place and not run.;
Manufacturer:
AOS Thermal Compounds
Non-Silicone XT-4
Grease; 1-Part; Grease; Non-silicone; None;
Recommended for high-temperature heat transfer in silicone sensitive applications. Non-Silicone XT-4 is a
non-silicone-based thermally conductive gray paste/grease, compounded with 100% synthetic base
stocks.;
Manufacturer:
AOS Thermal Compounds
Non-Silicone HTC 52070
Thermal grease; 1-Part; Grease; Non-silicone; None;
A highest conductivity, non-silicone, thixotropic thermal gap filler. The material will never bleed, phase seperate or pump out under typical applications.;
Manufacturer:
AOS Thermal Compounds
Sure-form Non-Silicone Gap Filler 52041
Gap Filler; 1-Part; Sheets; Non-silicone; None;
Non-silicone heat sink compound for power electronics cooling.;
Manufacturer:
AOS Thermal Compounds
340 LR
Thermal grease; 1-Part; Grease; Non-silicone; None;
A non-silicone based, non-reactive, and non-abrasive with a soft, grease-like consistency with thixotropic behavior. It has excellent dielectric properties, lowest thermal resistance and superior durability.;
Manufacturer:
AOS Thermal Compounds
Micro-Faze K
Thermal Interface Pad; 1-Part; Thermal pad; Non-silicone
thermal grease; None;
A revolutionary dry-to-touch thermal interface pad formulated with non-silicone thermal grease.;
Manufacturer:
AOS Thermal Compounds
Non-Silicone XT-3
Grease; 1-Part; Grease; Non-silicone; None;
Recommended for high-temperature heat transfer in silicone sensitive applications where out gassing is the
main concern.;
Manufacturer:
AOS Thermal Compounds
Electrically Conductive Grease 57001
Grease; 1-Part; Grease; Non-Silicone-based; None
A NON-SILICONE-based, chemically inert heat sink compound that is thermally stable.
Manufacturer: AOS Thermal Compounds
Chemical Resistance: Chemically inert
Sure-Form Gap Filling Gel 52057
Gap Filling; 1-Part; Grease; Non-silicone; Moisture
A one part, non-silicone, synthetic-based thermal grease.
Manufacturer: AOS Thermal Compounds
Non-Silicone HTC 52053
Gap filler; 1-Part; Paste; Non-silicone; Moisture
A dispensable, one-part, non-silicone gap filler.
Manufacturer: AOS Thermal Compounds
Sure-Form 53
Gap filler; 1-Part; Paste; Non-silicone; Moisture cure
A dispensable, one-part, non-silicone gap filler. Very tacky, very viscous, resists vibration and shock. Gray paste, will stay in place and not run.
Manufacturer: AOS Thermal Compounds
Package Sizes
30cc Syringe
Non-Silicone XT-4
Grease; 1-Part; Grease; Non-silicone; None
Recommended for high-temperature heat transfer in silicone sensitive applications. Non-Silicone XT-4 is a
non-silicone-based thermally conductive gray paste/grease, compounded with 100% synthetic base
stocks.
Manufacturer: AOS Thermal Compounds
Non-Silicone HTC 52070
Thermal grease; 1-Part; Grease; Non-silicone; None
A highest conductivity, non-silicone, thixotropic thermal gap filler. The material will never bleed, phase seperate or pump out under typical applications.
Manufacturer: AOS Thermal Compounds
Sure-form Non-Silicone Gap Filler 52041
Gap Filler; 1-Part; Sheets; Non-silicone; None
Non-silicone heat sink compound for power electronics cooling.
Manufacturer: AOS Thermal Compounds
340 LR
Thermal grease; 1-Part; Grease; Non-silicone; None
A non-silicone based, non-reactive, and non-abrasive with a soft, grease-like consistency with thixotropic behavior. It has excellent dielectric properties, lowest thermal resistance and superior durability.
Manufacturer: AOS Thermal Compounds
Package Sizes
30cc Syringe
Micro-Faze K
Thermal Interface Pad; 1-Part; Thermal pad; Non-silicone
thermal grease; None
A revolutionary dry-to-touch thermal interface pad formulated with non-silicone thermal grease.
Manufacturer: AOS Thermal Compounds
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
AOS Thermal Compounds
Chemically inert
Grease
1-Part
A NON-SILICONE-based, chemically inert heat sink compound that is thermally stable.
AOS Thermal Compounds
Gap Filling; Thermal Grease
1-Part
A one part, non-silicone, synthetic-based thermal grease.
AOS Thermal Compounds
Gap filler
1-Part
A dispensable, one-part, non-silicone gap filler.
AOS Thermal Compounds
Gap filler
1-Part
A dispensable, one-part, non-silicone gap filler. Very tacky, very viscous, resists vibration and shock. Gray paste, will stay in place and not run.
AOS Thermal Compounds
Grease
1-Part
Recommended for high-temperature heat transfer in silicone sensitive applications. Non-Silicone XT-4 is a
non-silicone-based thermally conductive gray paste/grease, compounded with 100% synthetic base
stocks.
AOS Thermal Compounds
Thermal grease
1-Part
A highest conductivity, non-silicone, thixotropic thermal gap filler. The material will never bleed, phase seperate or pump out under typical applications.
AOS Thermal Compounds
Gap Filler
1-Part
Non-silicone heat sink compound for power electronics cooling.
AOS Thermal Compounds
Thermal grease
1-Part
A non-silicone based, non-reactive, and non-abrasive with a soft, grease-like consistency with thixotropic behavior. It has excellent dielectric properties, lowest thermal resistance and superior durability.
AOS Thermal Compounds
Thermal Interface Pad
1-Part
A revolutionary dry-to-touch thermal interface pad formulated with non-silicone thermal grease.
AOS Thermal Compounds
Grease
1-Part
Recommended for high-temperature heat transfer in silicone sensitive applications where out gassing is the
main concern.
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