Monopox DA255
Bond; 1-Part; Liquid; Free of solvents; Heat-curing;
• Modified epoxy resin • 1C • Heat-curing ▪ Free of solvents • Compliant with RoHS directive 2015/863/EU • Halogen-free according to IEC 61249-2-21 • Die attach adhesive • Electronic adhesive.;
Duopox 03 Rapid Thix
Bond; 2-Part; Pasty; Modified epoxy resin; Room-temperature-curing;
• Modified epoxy resin • 2C • Room-temperature-curing • Flow-resistant, suitable for side-by-side cartridges, unfilled, pasty • 1:1 mix ratio.;
Photobond 4442
Sealant; 1-Part; Liquid; Modified acrylate; UV- / VIS-curing;
• Modified acrylate • 1C • UV- / VIS-curing • Free of solvents • Unfilled • Sealant • Compliant with RoHS Directive 2015/863/EU • Tested for biocompatibility and meets the requirements according to USP 23, 1995, Class VI plastics -70 °C.;
ML DB133
Bonding; 1-Part; Liquid; Modified acrylate; UV curing;
• 1C • Modified acrylate • UV- / anaerobic-curing • Free of solvents • Compliant with RoHS directive 2015/863/EU • Construction adhesive • Structural adhesive • Glass/metal bondings.;
Dualbond MF4990
Adhesive; 1-Part; Liquid; Modified acrylate; Humidity cure;
▪ One-component ▪ Glass/metal bondings ▪ Humidity-curing ▪ Modified acrylate ▪ Free of solvents ▪ Adhesive ▪ Unfilled ▪ Blue fluorescent;
Dualbond AD342
Adhesive; 1-Part; Liquid; Modified Polycarbaminacid; UV;
A One- component , Solvent - free, UV-heatcuring adhesive and compliant with RoHS directive 2011/65/EU.;
Photobond AD491
Bonding; 1-Part; Liquid; Modified acrylate; UV- / VIS-curing;
▪ Modified acrylate ▪1C ▪ UV- / VIS-curing ▪ Free of solvents ▪ Low outgassing ▪ Unfilled ▪ Compliant with RoHS Directive 2015/863/EU ▪ Glass/metal bondings ▪ Mixed bondings with plastics. ;
Dualbond LT2277
Bond; 1-Part; Liquid; Free of antimony; Heat;
• Modified epoxy resin • 1C • Heat-curing • Free of solvents • Free of antimony • Flow-resistant • Filled • Light-blocking • Thixotropic • Compliant with RoHS Directive 2015/863/EU;
Gum SJ3096
Encapsulant; 1-Part; Liquid; Acetic-acid-crosslinking silicone rubber; Room-temperature-curing;
▪ Acetic-acid-crosslinking silicone rubber ▪ 1C ▪ Room-temperature-curing ▪ Free of solvents ▪ Self-leveling ▪ Very good temperature resistance ▪ Compliant with RoHS Directive 2015/863/EU.;
Katiobond EG6133
Encapsulant; 1-Part; Liquid; Free of solvents; UV-curing;
• Modified epoxy resin • 1C • UV-curing • Free of solvents • No corrosive effect • Flowable • Unfilled • Sealant • Electronic encapsulant • Pin potting • -40 - 160 °C.;