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Epo-Tek EJ2189-LV
Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure;
An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.;
Manufacturer:
Epoxy Technology
Epo-Tek 430
Bonding; 2-Part; Thick paste; Epoxy; 2- Part Cure;
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics.
It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.;
Manufacturer:
Epoxy Technology
Epo-Tek 310M
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure;
A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. It has a low viscosity, water-like appearance.;
Manufacturer:
Epoxy Technology
Epo-Tek 323LP-T
Adhesive; 2-Part; Slightly thixotropic paste; Epoxy; Part A/Part B;
Slightly thixotropic paste, Higher viscosity verion of EPO-TEK® 323LP.;
Manufacturer:
Epoxy Technology
Epo-Tek TV2001
Bonding; 2-Part; Paste; Epoxy; Snap-curing;
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.;
Manufacturer:
Epoxy Technology
Epo-Tek 360ST
Bonding; 2-Part; Paste; Epoxy; 2-Part Cure;
A two component, high temperature grade, electrically and thermally insulating epoxy, suitable for fiber optic and circuit assembly applications, high temperature adhesive for hybrids.;
Manufacturer:
Epoxy Technology
Epo-Tek TV1002
Adhesive; 1-Part; Smooth paste; Polyimide; Heat;
A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications.;
Manufacturer:
Epoxy Technology
Epo-Tek H35-175MP
Bond; 1-Part; Paste; Epoxy; Heat;
A single component, silver-filled epoxy for hybrid die and component attach. Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes. ;
Manufacturer:
Epoxy Technology
Epo-Tek 930-1
Thermal adhesive; 2-Part; Paste; Epoxy; 2-Part Cure;
A two part, thermally conductive, electrically insulating epoxy, can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.;
Manufacturer:
Epoxy Technology
Epo-Tek 354-T
Bond; 2-Part; Smooth thixotropic paste; Epoxy; Part A/Part B;
A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies.;
Manufacturer:
Epoxy Technology
Epo-Tek EJ2189-LV
Adhesive; 2-Part; Paste; Epoxy; 2-Part Cure
An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.
Manufacturer: Epoxy Technology
Epo-Tek 430
Bonding; 2-Part; Thick paste; Epoxy; 2- Part Cure
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics.
It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.
Manufacturer: Epoxy Technology
Epo-Tek 310M
Bond; 2-Part; Liquid; Epoxy; 2-Part Cure
A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. It has a low viscosity, water-like appearance.
Manufacturer: Epoxy Technology
Epo-Tek 323LP-T
Adhesive; 2-Part; Slightly thixotropic paste; Epoxy; Part A/Part B
Slightly thixotropic paste, Higher viscosity verion of EPO-TEK® 323LP.
Manufacturer: Epoxy Technology
Epo-Tek TV2001
Bonding; 2-Part; Paste; Epoxy; Snap-curing
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.
Manufacturer: Epoxy Technology
Epo-Tek 360ST
Bonding; 2-Part; Paste; Epoxy; 2-Part Cure
A two component, high temperature grade, electrically and thermally insulating epoxy, suitable for fiber optic and circuit assembly applications, high temperature adhesive for hybrids.
Manufacturer: Epoxy Technology
Epo-Tek TV1002
Adhesive; 1-Part; Smooth paste; Polyimide; Heat
A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications.
Manufacturer: Epoxy Technology
Epo-Tek H35-175MP
Bond; 1-Part; Paste; Epoxy; Heat
A single component, silver-filled epoxy for hybrid die and component attach. Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.
Manufacturer: Epoxy Technology
Epo-Tek 930-1
Thermal adhesive; 2-Part; Paste; Epoxy; 2-Part Cure
A two part, thermally conductive, electrically insulating epoxy, can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.
Manufacturer: Epoxy Technology
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Epoxy Technology
Adhesive; EMI shielding
2-Part
An electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.
Epoxy Technology
Bonding; EMI RF shielding; EMI RF shielding
2-Part
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics.
It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.
Epoxy Technology
Bond; Potting
2-Part
A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. It has a low viscosity, water-like appearance.
Epoxy Technology
Adhesive
2-Part
Slightly thixotropic paste, Higher viscosity verion of EPO-TEK® 323LP.
Epoxy Technology
Bonding
2-Part
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.
Epoxy Technology
Bonding
2-Part
A two component, high temperature grade, electrically and thermally insulating epoxy, suitable for fiber optic and circuit assembly applications, high temperature adhesive for hybrids.
Epoxy Technology
Adhesive
1-Part
A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications.
Epoxy Technology
Bond
1-Part
A single component, silver-filled epoxy for hybrid die and component attach. Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.
Epoxy Technology
Thermal adhesive
2-Part
A two part, thermally conductive, electrically insulating epoxy, can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.
Epoxy Technology
Bond; Encapsulation; Potting; Sealing
2-Part
A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies.
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