GSP 1603-3
Potting; 2-Part; Compound; Polyurethane; 2-Part Cure;
A two-part polyurethane potting compound used for potting components. It provides between one and two hours of working time.;
GSP 1534-11
Bond; 2-Part; Thixotropic Liquid; Polyurethane; Part A/Part B;
A two-part polyurethane adhesive with a 2-3 minute gel time. When applied, the material quickly forms a thixotropic bead. The material cures to a shiny/glossy finish and remains slightly flexible and bendable. ;
GSP 5560
Bond; 2-Part; Liquid; Polyurethane; 2 Part;
A two component elastomeric polyurethane casting and tooling system. Its features include an easy mix ratio of 1:1 parts by volume, high tear strength, low viscosity and good adhesion for a castable system. ;
AD204-3
Bond; 1-Part; Liquid; Polyurethane; Room temperature cure;
A one-part, reactive polyurethane glue that cures at room temperature. This system was developed for bonding a variety of porous and non-porous substrates such as wood, fabric, leather, ABS, concrete, and PVC.;
GSP 1603-5
Potting; 2-Part; Liquid; Solvent-Free; 2 Part;
A two component polyurethane potting system developed for use as an electrical potting encapsulant.;
GSP 1570-3
Pot; 2-Part; Liquid; Polyurethane; 2 Part;
A cost effective, two-component, very fast cure, general purpose polyurethane potting system. It contains hydrophobic properties and provides excellent water resistance. ;
GSP 1414
Bond; 2-Part; Liquid; Soft Polyurethane/Epoxy Hybrid; 2 Part;
This is specially formulated to withstand temperatures higher than the typical range of a polyurethane. When applied, the material forms a white thixotropic bead. It also provides good hydrolytic stability. ;
GSP 1450-9T400
Bond; 2-Part; Liquid; Polyurethane; 2-Part Cure;
A two-part modified polyurethane adhesive designed to bond to a variety of substrates where longer gel times are required for assembly of bonded components. This adhesive bonds very well to clean metal surfaces as well as damp, porous and wood surfaces.;
CDP 3604
Dieletric gel; 1-Part; Gel; Hydrophobic; Non-drying (non-hardening);
A one-component, hydrophobic, non-drying (non-hardening) gel. It is water-clear and semi-thixotropic. This material is designed to protect electronic connections from moisture and oxidation.;
GSP 1325-2
Bonding; 2-Part; Liquid; Epoxy; 2-Part cure;
A two-part epoxy adhesive system. When applied, the semi-thixotropic material forms a slow-flowing, off-white bead. It provides 15-20 minutes of workable time before it gels.;