Loctite 401
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Loctite SF 7649
Primer; 1-Part; Liquid; Acetone; Solvent;
A solvent-based primer that features very long on-part life. Use to speed the cure of all Loctite® brand anaerobic products and ensure proper cure on inactive metals. Ideal for cure conditions below room temperature.;
Loctite 3609
Bond; 1-Part; Gel; Epoxy; Heat;
It is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.;
Loctite Ablestik 104
Bond; 2-Part; Paste; Epoxy; Heat;
● Black liquid ● Two component - requires mixing ● Excellent chemical resistance ● Non-conductive
● High shear strength ● High temperature resistance ● Long pot life ● Heat cure;
Loctite Stycast 5954
Encapsulate; 2-Part; Liquid; Silicone; Part A/Part B;
● High thermal conductivity ● Reversion resistant ● Non-Corrosive ● High electrical insulation ● Easy mix ratio ● Heat Cure ● Encapsulant
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Loctite Ablestik 56C w/ Cat 11
Bond; 2-Part; Thixotropic Paste (Adhesive); Epoxy; Heat Cure;
Two component, high temperature, general purpose. Adhesive - Electrically Conductive;
Loctite EA 9462
Bond; 2-Part; Smooth paste; Epoxy; Resin/Hardener;
Excellent strength, impact resistant, non-sag epoxy.;
Armstrong A-12T Epoxy Resin
Bond; 2-Part; Paste; Epoxy; Part A/Part B;
Two-part epoxy based formulation; high strength, permanent bonds, low shrinkage, excellent wetting characteristics, non-critical mix ratio can vary to obtain a more flexible or rigid bond. .;
Loctite 410
Bond; 1-Part; Liquid; Toughened; Humidity;
Rubber toughened adhesive with increased flexibility and peel strength along with enhanced resistance to shock.;
Loctite Stycast 1265
Encapsulate; 2-Part; Liquid; Epoxy; Part A/Part B;
It is a clear, two component soft gel, epoxy encapsulant. It is tough, has hardness and a long pot life. It may be used as a flexible adhesive, excellent adhesion to a wide variety of substrates.;