RTVS 27
Casting; 2-Part; Liquid; Silicone; RTV;
A low viscosity UL 94V-0 Flame Retardant, general purpose, reversion resistant RTV Silicone.;
Insulgel 70CC FRNS
Encapsulant; 2-Part; Compound; Epoxy; Part A/ Part B;
An epoxy compound which exhibits superior thermal shock resistance by making use of an inherently flexible epoxy resin and special filler technology.;
Insulcast 771/781 PMT
Bond; 1-Part; Liquid; Epoxy; Heat;
A clear, one-component, liquid, rigid, heat cure epoxy system which exhibits high heat resistance.
;
RTVS Primer 40
Primer; 1-Part; Liquid; Dilute solution of reactive silicone resins; RTV;
Primer is a dilute solution of reactive silicone resins which can be used to improve or add adhesion of one and two component condensation (tin) cure silicone RTV materials.;
RTVS A-4000
Bond; 2-Part; Liquid; Solvent-Based; RTV;
A two component solvent based silicone resin adhesive. It will retain flexibility over an elevated temperature.;
Insulcast 987
Potting; 2-Part; Liquid; Epoxy; 2-Part Cure;
A semi-flexible, potting compound that exhibits excellent electrical and physical properties over a wide range of
temperatures. Neutral color.;
42
Potting; 2-Part; Liquid; Silicone-epoxy co-polymer; Ambient temperatures;
A low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, and excellent dielectric insulation. It bonds well to most metals and plastics.;
504
Casting; 1-Part; Liquid; Epoxy; Room Temperature Cure;
An unfilled 100% solids epoxy resin casting or impregnating material. The product has excellent physical and electrical properties. The product has excellent physical and electrical properties.;
RTVS 187 LV
Sealant; 2-Part; Compound; Silicone; RTV;
A self adhering, self extinguishing condensation silicone compound suggested for coatings, encapsulants and sealants.;
Insulcast 3230 LV w/ Insulcure 11B
Casting; 2-Part; Compound; Epoxy; 2-Part Cure;
A low viscosity, highly filled epoxy formulation that in addition to excellent electrical properties, has unusually
high thermal conductivity, with low thermal expansion.;