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Metaduct 1201
Bond; 2-Part; Paste; Solvent free; 2-Part Cure;
A 100% solids, solvent free, highly conductive adhesive. It is supplied in a paste form, adheres tenaciously to glass, aluminum, steel, tin, lead, copper, ceramic, most plastics and to many other surfaces.;
Manufacturer:
Mereco
Metasil 5021 w/ Liquid Activator
Encapsulating; 2-Part; Liquid; Silicone; RTV;
A two component, general purpose RTV silicone designed specifically for potting and encapsulating applications in the electrical industry.;
Manufacturer:
Mereco
Metrethane 4707
Potting; 2-Part; Elastomer; Urethane resin; 2-Part Cure;
A two-component, low viscosity system that provides excellent protection of electronic components ranging from transducers, sensors, load cells, delicate magnetic coils and bobbins to power supply applications;
Manufacturer:
Mereco
4580 w/ Hardener 19
Encapsulating; 2-Part; Liquid; Epoxy resin; 2-Part Cure;
An epoxy resin general purpose encapsulating compound especially well suited to the stringent requirements of high-density circuit packages, miniaturized component assemblies, circuit elements, and micro-module encapsulations.;
Manufacturer:
Mereco
Chemical Resistance:
Exhibits excellent chemical resistance
XLN-760
Air release; 1-Part; Liquid; Non-silicone; None;
• 1-part • Liquid • Non-silicone • Air release.;
Manufacturer:
Mereco
Metrethane 4758
Potting; 2-Part; Elastomer; Urethane resin; 2-Part Cure;
A two-component, low viscosity system that provides excellent protection of electronic components ranging from transducers, sensors, load cells, delicate magnetic coils and bobbins to power supply applications.;
Manufacturer:
Mereco
Metregrip 357
Bond; 2-Part; Paste; Epoxy; 2-part cure;
• 2-Part • Thioxotropic • Paste • High bond strength • Epoxy adhesive • 2-Part cure.;
Manufacturer:
Mereco
CLN-672
Bond; 2-Part; Liquid; Epoxy; Heat cure;
A high temperature resistant, thermally conductive epoxy with good heat dissipating properties. It is easy to use and apply in encapsulation, potting and adhesive applications.;
Manufacturer:
Mereco
Metasil 5024T Mod 4
Bond; 2-Part; Paste; Silicone; RTV;
A two-component, solventless, addition curing silicone RTV material specifically designed for applications where a thermally conductive, thixotropic, medium durometer material is required. ;
Manufacturer:
Mereco
Chemical Resistance:
Chemical resistance
Metaduct 1225 SN-736
Bond; 2-Part; Liquid; Epoxy; Room temperature;
It is supplied in two parts which, when mixed, cure at room temperature into a rigid solid with excellent electrical conductivity -- low enough to satisfy most general purpose requirements.;
Manufacturer:
Mereco
Metaduct 1201
Bond; 2-Part; Paste; Solvent free; 2-Part Cure
A 100% solids, solvent free, highly conductive adhesive. It is supplied in a paste form, adheres tenaciously to glass, aluminum, steel, tin, lead, copper, ceramic, most plastics and to many other surfaces.
Manufacturer: Mereco
Metasil 5021 w/ Liquid Activator
Encapsulating; 2-Part; Liquid; Silicone; RTV
A two component, general purpose RTV silicone designed specifically for potting and encapsulating applications in the electrical industry.
Manufacturer: Mereco
Metrethane 4707
Potting; 2-Part; Elastomer; Urethane resin; 2-Part Cure
A two-component, low viscosity system that provides excellent protection of electronic components ranging from transducers, sensors, load cells, delicate magnetic coils and bobbins to power supply applications
Manufacturer: Mereco
4580 w/ Hardener 19
Encapsulating; 2-Part; Liquid; Epoxy resin; 2-Part Cure
An epoxy resin general purpose encapsulating compound especially well suited to the stringent requirements of high-density circuit packages, miniaturized component assemblies, circuit elements, and micro-module encapsulations.
Manufacturer: Mereco
Chemical Resistance: Exhibits excellent chemical resistance
XLN-760
Air release; 1-Part; Liquid; Non-silicone; None
• 1-part • Liquid • Non-silicone • Air release.
Manufacturer: Mereco
Metrethane 4758
Potting; 2-Part; Elastomer; Urethane resin; 2-Part Cure
A two-component, low viscosity system that provides excellent protection of electronic components ranging from transducers, sensors, load cells, delicate magnetic coils and bobbins to power supply applications.
Manufacturer: Mereco
Metregrip 357
Bond; 2-Part; Paste; Epoxy; 2-part cure
• 2-Part • Thioxotropic • Paste • High bond strength • Epoxy adhesive • 2-Part cure.
Manufacturer: Mereco
CLN-672
Bond; 2-Part; Liquid; Epoxy; Heat cure
A high temperature resistant, thermally conductive epoxy with good heat dissipating properties. It is easy to use and apply in encapsulation, potting and adhesive applications.
Manufacturer: Mereco
Metasil 5024T Mod 4
Bond; 2-Part; Paste; Silicone; RTV
A two-component, solventless, addition curing silicone RTV material specifically designed for applications where a thermally conductive, thixotropic, medium durometer material is required.
Manufacturer: Mereco
Chemical Resistance: Chemical resistance
Manufacturer
Chemical Resistance
Application Type
1 Part or 2 Part
Description
Mereco
Bond
2-Part
A 100% solids, solvent free, highly conductive adhesive. It is supplied in a paste form, adheres tenaciously to glass, aluminum, steel, tin, lead, copper, ceramic, most plastics and to many other surfaces.
Mereco
Encapsulating; Potting
2-Part
A two component, general purpose RTV silicone designed specifically for potting and encapsulating applications in the electrical industry.
Mereco
Potting
2-Part
A two-component, low viscosity system that provides excellent protection of electronic components ranging from transducers, sensors, load cells, delicate magnetic coils and bobbins to power supply applications
Mereco
Exhibits excellent chemical resistance
Encapsulating
2-Part
An epoxy resin general purpose encapsulating compound especially well suited to the stringent requirements of high-density circuit packages, miniaturized component assemblies, circuit elements, and micro-module encapsulations.
Mereco
Air release
1-Part
• 1-part • Liquid • Non-silicone • Air release.
Mereco
Potting
2-Part
A two-component, low viscosity system that provides excellent protection of electronic components ranging from transducers, sensors, load cells, delicate magnetic coils and bobbins to power supply applications.
Mereco
Bond
2-Part
• 2-Part • Thioxotropic • Paste • High bond strength • Epoxy adhesive • 2-Part cure.
Mereco
Bond; Encapsulation; Potting
2-Part
A high temperature resistant, thermally conductive epoxy with good heat dissipating properties. It is easy to use and apply in encapsulation, potting and adhesive applications.
Mereco
Chemical resistance
Bond
2-Part
A two-component, solventless, addition curing silicone RTV material specifically designed for applications where a thermally conductive, thixotropic, medium durometer material is required.
View Datasheet
Contact Rep
Contact Rep
Interested in Package Size:
Pint Quart 2 Quart 2 Gallon kit 50ml Dual cartridge 50cc Dual cartridge 200ml Dual cartridge 400ml Dual cartridge
Mereco
Bond
2-Part
It is supplied in two parts which, when mixed, cure at room temperature into a rigid solid with excellent electrical conductivity -- low enough to satisfy most general purpose requirements.
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