Loctite 401
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength.;
268
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Moisture;
A medium-high viscosity cyanoacrylate for large gap fill applications. The adhesive bonds to a wide range of substrates including metals, ceramics, plastics and elastomers.;
102
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Moisture;
A Single component, low viscosity general purpose cyanoacrylate adhesive, bonding product useful in applications or bonding closely fitting parts. It is fast setting and suitable for use on plastics, rubber and metals.;
Loctite 410
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Rubber toughened adhesive with increased flexibility and peel strength along with enhanced resistance to shock.;
Loctite 425
Threadlocker; 1-Part; Liquid; Cyanoacrylate; Humidity;
Designed as a fast curing, low strength adhesive for locking metal and plastics fasteners. The product is designed for pre- or post-application.;
200
Bond; 1-Part; Liquid; Cyanoacrylate; Moisture;
A single component adhesives, high viscosity with good flow control, cyanoacrylate, component mounting, encapsulating.
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Cynergy CA6014
Bond; 1-Part; Liquid; Cyanoacrylate; Pressure Sensitive;
A single component, clear, solvent free adhesive for use in demanding applications where very fast cure speeds are required. Substrates such a wood, plastics, metal, rubber, or other materials are bonded quickly and effectively.;
Loctite 480
Bond; 1-Part; Liquid; Cyanoacrylate; Humidity;
A rubber toughened adhesive with increased flexibility and peel strength along with enhanced resistance to shock.;
Loctite 4471
Bond; 1-Part; Liquid; Ethyl cyanoacrylate; Humidity;
Designed for the assembly of difficult-to-bond materials which require uniform stress distribution and strong tension and/or shear strength.;
Loctite 382
Bond; 1-Part; Gel; Cyanoacrylate; Humidity;
Fast curing high viscosity adhesive formulated for electronics applications. Designed to use with TAK PAK® Accelerators to attain instant cures for tacking electronics components.;